Multi-Wafer Maker MWM Series
Micro-Precision Double-Disc Grinder MPG Series
Slurry Recycling System CSR Series
Wafer Automatic Cleaning System CCS Series
Orientation Measuring and Gluing System OMG Series
Contact Koki Ojima at NTC at: koki.ojima@ntcamerica.com 248.560.1202
It not only measures the crystallographic tilt angle of a single-crystal silicon ingot, but also it automatically glues a single crystal silicon ingot along the crystallographic axis.