Semiconductor
Manufacturing Equipment

Semiconductor Wafer Slicing Equipment & Solar Cell Wafer Slicing Equipment

Taking advantage of mechatronics and knowhow amassed in our company, we, NTC launch constantly equipment of high quality and high accuracy to the market of semiconductor manufacturing equipment.

 
Number 1 Solar Cell Manufacturing Equipment Worldwide

Recently, we dispatched more than 3,000 sets of solar cell equipment to a solar cell market under the attention as one of new energy resouces. Furthermore, we will offer a high production technology and thin-wafer slicing technique to a growing solar cell market.

 
Challenge for a New Market

Multi-wafer Maker, MWM series which allowed silicon wafer to be cut by the multi-wire saw for the first time in the world. Since then, every substrate material such as quartz and crystal can be sliced for liquid crystal industries. Besides, we are tackling a substrate slicing, and now we can slice hard materials such sapphire and magnetic materials. In addition, we propose a cutting equipment which meets the needs and wants of customers.

 

MWM442DM (Kiraller) This wire saw was designed for slicing semiconductor wafers and solar cell wafers as well as wafers of small diameter. Easy to use because of a compact design is well accepted and appreciated to be a best-selling machine. Maximum work size: 156 x L300 x 2 pieces

SP300Di (Kiraller) This SP300Di is designed for small diameter hard materials like Sapphire, SiC and Ceramics using diamond wire for high speed and high accuracy cutting. Maximum work size: Φ6" x L300 x 1 piece

MWM3050nQ (Kiraller) This MWM3050nQ pursues to slice a wafer of more than 8" for solar cell with a stable cutting accuracy The world's first NC cutting program installed to the machine allows various and detailed cutting process. Maximum work size: Φ12" x L450 x 1 piece

MWM650SQ and MWM1000SQ (Kiraller) These series are designed for slicing a quartz which is used as liquid crystal mask substrate. NTC's original technology allows wafer of one ( 1 ) square meter in diameter to be sliced. MWM650SQ is used for cutting target materials. Maximum work size: MWM650SQ - 650 x L400 x 1 piece, MWM1000SQ - 1100 x L350 x 1 piece

PV800H (Sun Friends) These machines are enjoying a favorable comment worldwide as the cutting machines for solar cel wafers. The machines are designed in details so that they are easy to use and shortening a cutting time with a high yield. In addition. These machine can accept a dismond wire to cut. Maximum work size: PV800S - 156 x L840 x 1 piece

MBS1000C (Sun Friends) This machine is called "Multi-Block Slicer " , which cuts an ingot for a solar cell in cubes. MBS1000 allows mass production, and less kerf loss compare with conventional band-saw cutting. Maximum work size: 1000 x H500 x 1 piece, Φ8" x H500 x 16 pieces, Φ6" x H500 x 25 piece

Slurry Recycle System CSR System This system removes cutting chips from wasted slurry ( Mixture of cutting chips, abrasive grain, and oil ) to recycle slurry used by MWM series.The system can protect environment and cut off a runninb cost remarkably . This full automation equipment can supply this recycled slurry to a wire saw. This system can be designed only by a wire saw manufacturer.

SWI-160C This system performes geometry measuring and detects all defects of wafer, inside and outside. Minute cracks are also detected, that improves the production yield of the cell process.


NTC America Corporation • 46605 Magellan Drive • Novi, MI 48377 • 248.560.1200 • 248.560.0215 fax • www.ntcamerica.com

 

 

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